集成电路封装材料的表征 / 材料表征原版系列丛书
￥98.00定价
作者： [美]布伦德尔 埃文斯 摩尔
出版时间：2014-01
出版社：哈尔滨工业大学出版社
- 哈尔滨工业大学出版社
- 9787560342825
- 96887
- 2014-01
- TN405
内容简介
《集成电路封装材料的表征(英文)》的主要内容包括： Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。
目录
Foreword
Preface to the Reissue of the Materials Characterization Series
Preface to Series xiv
Preface to the Reissue of Integrated Circuit Packaging Materials
Preface
Contributors
IC PACKAGE RELIABILITY TESTING
1.1 Introduction
1.2 In-Process Quality Measurements
Wire Bond Quality 3, Die Attach Quality 4, Other Process Control Measurements 8
1.3 Package-Oriented Reliability Testing of Finished Devices: Moisture Testing
Failure Analysis of Moisture-Related Failures 11, Root Causes of Corrosion Failures
1.4 Package-Oriented Reliability Testing of Finished Devices: Thermal Cycle Testing
Bond Failures: Bond Pad Contamination 16, Intermetallic Formation
and Other Elements of Bond Formation
1.5 Reliability Test Preconditioning: A New Direction
1.6 Summary
MOLD COMPOUND ADHESION AND STRENGTH
MECHANICAL STRESS IN IC PACKAGES
MOISTURE SENSITIVITY AND DELAMINATION
THERMAL MANAGEMENT
ELECTRICAL PERFORMANCE OF IC PACKAGES
SOLDERABILITY OF INTEGRATED CIRCUITS
HERMETICITY AND JOINING IN CERAMIC IC PACKAGES
ADVANCED INTERCONNECT TECHNOLOGY
APPENDIX: TECHNIQUE SUMMARIES
Preface to the Reissue of the Materials Characterization Series
Preface to Series xiv
Preface to the Reissue of Integrated Circuit Packaging Materials
Preface
Contributors
IC PACKAGE RELIABILITY TESTING
1.1 Introduction
1.2 In-Process Quality Measurements
Wire Bond Quality 3, Die Attach Quality 4, Other Process Control Measurements 8
1.3 Package-Oriented Reliability Testing of Finished Devices: Moisture Testing
Failure Analysis of Moisture-Related Failures 11, Root Causes of Corrosion Failures
1.4 Package-Oriented Reliability Testing of Finished Devices: Thermal Cycle Testing
Bond Failures: Bond Pad Contamination 16, Intermetallic Formation
and Other Elements of Bond Formation
1.5 Reliability Test Preconditioning: A New Direction
1.6 Summary
MOLD COMPOUND ADHESION AND STRENGTH
MECHANICAL STRESS IN IC PACKAGES
MOISTURE SENSITIVITY AND DELAMINATION
THERMAL MANAGEMENT
ELECTRICAL PERFORMANCE OF IC PACKAGES
SOLDERABILITY OF INTEGRATED CIRCUITS
HERMETICITY AND JOINING IN CERAMIC IC PACKAGES
ADVANCED INTERCONNECT TECHNOLOGY
APPENDIX: TECHNIQUE SUMMARIES
