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出版时间:2011-08-15

出版社:高等教育出版社

以下为《电子制造工程专业英语》的配套数字资源,这些资源在您购买图书后将免费附送给您:
  • 高等教育出版社
  • 9787040324488
  • 1
  • 62214744-5
  • 16开
  • 2011-08-15
  • 230
  • 微电子技术
  • 高职
内容简介

本书旨在使读者掌握电子制造工程专业群的英语术语及用法,培养和提高读者阅读和翻译专业英语文献资料的能力,为今后获取和交流专业技术信息打下良好的基础。全书共18课,内容包括电的本质、电场、简单电路、半导体材料、电化学基础、光化学基础、电子封装、印制电路板成像、电镀技术、柔性电路、柔性电路的检测、显示技术简介、液晶显示、等离子显示、发光二极管、半导体器件及集成电路、半导体制造工艺、封装及测试等。每课由课文、语法(或翻译或应用文)和扩展阅读组成。本书还简单介绍了翻译知识,并配有适量的练习与扩展阅读材料,供教师选用及学生自学用。


本书内容新颖,图文并茂,浅显易学,可用作光电子技术、电子电路设计与工艺、微电子技术、光伏发电技术及应用等专业的专业英语教材或教学参考书,也可供从事电子制造工程类专业的工程技术人员学习参考。

目录

 Lesson One
  Part Ⅰ Intensive Reading:The Nature of Electricity
  Part Ⅱ Grammar:Parts of Speech
  Part Ⅲ Extensive Reading:Why do We Get a Shock from Electricity?
 Lesson Two
  Part Ⅰ Intensive Reading:Electric Field, Potential and Voltage
  Part Ⅱ Grammar:Prefix and Suffix
  Part Ⅲ Extensive Reading:Electric Field and Electric Field Lines
 Lesson Three
  Part Ⅰ Intensive Reading:Simple Electric Circuit
  Part Ⅱ Grammar:Word-Formation
  Part Ⅲ Extensive Reading:DC Biasing—BJTs
 Lesson Four
  Part Ⅰ Intensive Reading:Semiconductor Material
  Part Ⅱ Grammar:Word-activity
  Part Ⅲ Extensive Reading:Growth of Semiconductor Materials
 Lesson Five
  Part Ⅰ Intensive Reading:Electrochemistry Basis
  Part Ⅱ Grammar:Sentence Backbones
  Part Ⅲ Extensive Reading:The History of Electrochemistry
 Lesson Six
  Part Ⅰ Intensive Reading:Photochemistry Basis
  Part Ⅱ Grammar:Sentence Elements
  Part Ⅲ Extensive Reading:Photolithography Introduction
 Lesson Seven
  Part Ⅰ Intensive Reading:Electronic Package and High-density Interconnectivity
  Part Ⅱ Grammar:Complex Sentence Ⅰ
  Part Ⅲ Extensive Reading:Electronic Packaging
 Lesson Eight
  Part Ⅰ Intensive Reading:Printed Circuit Board Imaging
  Part Ⅱ Grammar:Complex sentence Ⅱ
  Part Ⅲ Extensive Reading:HannStar Board-GBM Consolidation to Create Largest PCB Maker in Taiwan Province
 Lesson Nine
  Part Ⅰ Intensive Reading:Plated-Through-Hole(PTH)Technology
  Part Ⅱ Translation Skills:Translation Standards and Process
  Part Ⅲ Extensive Reading:The Disadvantages of Pattern Plating
 Lesson Ten
  Part Ⅰ Intensive Reading:Flexible Circuits
  Part Ⅱ Translation Skills:Conversion of Part of Speech
  Part Ⅲ Extensive Reading:Design of Flexible Circuits
 Lesson Eleven
  Part Ⅰ Intensive Reading:Inspection and Test of Flexible Circuits
  Part Ⅱ Translation Skills:Translation of Complex Sentences in Scientific English
  Part Ⅲ Extensive Reading:Printed Electronics Make PCB “Green Up”
 Lesson Twelve
  Part Ⅰ Intensive Reading:Introduction of Display Technology
  Part Ⅱ Translation Skills:Amplification and Deletion
  Part Ⅲ Extensive Reading:Flat Panel Buying Tips
 Lesson Thirteen
  Part Ⅰ Intensive Reading:Liquid Crystal Display
  Part Ⅱ Practical Writing:Resume
  Part Ⅲ Extensive Reading:High Luminance and Wide Color Gamut—for clear, vivid color
 Lesson Fourteen
  Part Ⅰ Intensive Reading:Plasma Display Panel
  Part Ⅱ Practical Writing:Cover Letter
  Part Ⅲ Extensive Reading:Full HD Plasma Panel Creates a True Full HD 3D World
 Lesson Fifteen
  Part Ⅰ Intensive Reading:Light Emitting Diodes
  Part Ⅱ Practical Writing:Reference Letter
  Part Ⅲ Extensive Reading:Organic Light Emitting Diodes
 Lesson Sixteen
  Part Ⅰ Intensive Reading:Semiconductor Devices and Integrated Circuits
  Part Ⅱ Practical Writing:Advertisement
  Part Ⅲ Extensive Reading:How Solar Cells Work?
 Lesson Seventeen
  Part Ⅰ Intensive Reading:Semiconductor Manufacturing Processes
  Part Ⅱ Practical Writing:Self-Introduction
  Part Ⅲ Extensive Reading:Photolithography
 Lesson Eighteen
  Part Ⅰ Intensive Reading:Packaging and Testing
  Part Ⅱ Practical Writing:Work Report
  Part Ⅲ Extensive Reading:Chip Scale Package
 Reference